TRICONEX HCU3700/3703E High performance multi-function microprocessor from Invensys
The brand TRICONEX color standard applies industrial height 284mm rated current 336mA
Protection Level IP45 Suitable for motor power 126KW Application Site Power Industry Material Code GJR2391500R1220 Power industry HIEE401782R0001 Part Number HCU370/3703E
Applicable pipe 2 Whether imported is weighing 2.96 kg can be sold nationwide
TRICONEX HCU3700/3703E High performance multi-function microprocessor from Invensys
HCU3700/3703E microchips announced New SMC 1000 8x25G serial memory controllers for cpus and other computationally-centric SOCs can utilize four times as many memory channels as parallel DRAM connections in the same package size as DDR4. The new serial memory controller will remove a major obstacle for the next generation of cpus, which require more memory channels to provide more memory bandwidth. The new SMC 1000 8x25G serial memory controller capability provides higher memory bandwidth and media independence for these compute-intensive platforms, with ultra-low latency. The SMC 1000 8x25G takes advantage of the increased number of processing cores in the CPU, so the average memory bandwidth available per processing core has decreased. This is because CPU and SoC devices cannot scale the number of parallel DDR interfaces on a single chip to meet the needs of the increasing number of cores.
The HCU3700/3703E MC 1000 8x25G serial memory controller can interface with the CPU using a 25 Gbps channel that complies with the 8-bit Open Memory Interface (OMI) standard, and can be brided to memory via a 72-bit DDR4 3200 interface. This results in a significant reduction in the number of host CPU or SoC pins required per DDR4 memory channel, allowing for more memory channels and increasing the available memory bandwidth. The innovative low-latency design enables memory systems using this product to have nearly the same bandwidth and latency performance as comparable LRDIMM products. In contrast to LRDIMMs, which use RCD buffers and separate data buffers, the SMC 1000 8x25G integrates data and addresses into a unified chip.
The SMC 1000 8x25G integrates an on-chip processor that performs control path and monitoring functions such as temperature monitoring, initialization, and diagnostics. In addition, the device supports manufacturing test operations for additional DRAM memory. The device can be used as a basic building block for a variety of OMI memory applications, including differential dual-in-line memory module (DDIMM) applications such as standard Height 2U DDIMMs with capacities from 16 GB to 128 GB and dual-height 2U DDIMMs with capacities over 256 GB.
TRICONEX HCU3700/3703E High performance multi-function microprocessor from Invensys
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